电解改性水在超细石膏粉制备中的应用研究

天津科技 ›› 2023, Vol. 50 ›› Issue (12): 31-34.

电解改性水在超细石膏粉制备中的应用研究

张钰, 吴忠意, 弥芯怡, 马逸尘, 王宇斌

西安建筑科技大学资源工程学院陕西西安 710055

收稿日期:2023-12-04 出版日期:2023-12-25 发布日期:2023-12-26
基金资助:
国家自然科学基金“基于磁化预处理的半水硫酸钙晶须制备改性一体化”（51974218）; 国家级大学生创新创业训练计划项目“电解

Study on Application of Electrolytic Modified Water in Preparation of Ultrafine Gypsum Powder

ZHANG Yu, WU Zhongyi, MI Xinyi, MA Yichen, WANG Yubin

School of Resources and Engineering,Xi'an University of Architecture and Technology,Xi'an 710055,Shaanxi Province,China

Received:2023-12-04 Online:2023-12-25 Published:2023-12-26

摘要/Abstract

摘要： 为制备超细石膏粉体,利用电解改性水进行生石膏料浆的超细磨试验,并采用激光粒度分析仪对生石膏超细磨产品粒度和比表面积进行表征。结果表明,电解改性水对改善生石膏超细磨效果明显。在料浆浓度为16%、超细磨时间为25 min、电解电流为0.16 A、电解时间为20 min、阳极板为铝板、极板间距为2 cm的条件下,可获得d₅₀为1.37 μm的超细磨石膏粉体。与未改性水相比,超细磨产品的d₉₀可从54.60 μm减小至2.21 μm,比表面积则从203 cm²/g增大至2 265 cm²/g。

关键词: 生石膏, 超细磨, 电解改性

Abstract: In order to prepare ultrafine gypsum powder,the ultrafine grinding test of gypsum slurry was carried out with electrolytic modified water,the particle size and specific surface area of raw gypsum ultrafine grinding products were characterized by a laser particle scale analyzer. The results show that the electrolytic modified water is effective in improving the ultrafine grinding of raw gypsum. Under the slurry concentration of 16%,ultrafine grinding time of 25 min,electrolysis current of 0.16 A,electrolysis time of 20 min,anode plate of aluminum plate,and plate spacing of 2 cm,ultrafine grinding gypsum powder with d₅₀ of 1.37 μm can be obtained. Compared with the unmodified water,the d₉₀ of the superfine grinding product can decrease from 54.60 μm to 2.21 μm,and the specific surface area can increase from 203 cm²/g to 2 265 cm²/g.

Key words: raw gypsum, ultrafine grinding, electrolytic modification

中图分类号:

TD985

张钰, 吴忠意, 弥芯怡, 马逸尘, 王宇斌. 电解改性水在超细石膏粉制备中的应用研究[J]. 天津科技, 2023, 50(12): 31-34.

ZHANG Yu, WU Zhongyi, MI Xinyi, MA Yichen, WANG Yubin. Study on Application of Electrolytic Modified Water in Preparation of Ultrafine Gypsum Powder[J]. TIANJIN SCIENCE & TECHNOLOGY, 2023, 50(12): 31-34.

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